Low-temperature curing low-elasticity conductive adhesive
70℃ curing possible - good conductivity!
Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~
- Company：ナミックス
- Price：Other
